Smaller components mean less power and less heat generated for the same RF output.
What world are you living in man?!?
Smaller components = You can fit more components in. Which pushes up overall power draw. That has always been the case.
Name one fighter that has not experienced weight growth, power requirement increases and cooling requirem through service life!!
One of the specific benefits of GaN over GaAs is lower power and heat per transmitted watt of RF energy.
But what happens is you’ll have more T/R modules, and you’ll try and pump more power into them to get more RF energy which equals overall power and heat increases. Always been the case.
So, almost 10 times the performance for less power and less heat.
But, if you look at CPUs and GPUs from 10 years ago… well actually, maybe not, ‘cos that would have been the Pentium 4 disaster, but say, 20 years ago and you’ll instantly notice a few things.
– Much less power consumption 20 yrs ago.
– Much less heat to be dissipated 20 yrs ago.
– Much smaller heatsinks as a result 20 yrs ago.
– Much smaller PCUs as a result 20 yrs ago.
– Much, much less overall performance 20 yrs ago.
The increase in performance/electrical watt and performance/thermal watt has not been accompanied by a decrease in overall wattage, either thermal or electrical.
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