Irkut production line (including Su-30SM):

http://www.vesti.ru/only_video.html?vid=473371

I’m surprised and mildly irritated at the quality of some of those pics, most are significantly worse than those released immediately after T-50-4’s first flight last week. I wonder if they’re just HD video prints, as yet no-one has put a name to them…or is this the new norm courtesy of the ФСБ.

Vladimir Ivanenko’s (quality) high-res. images of T-50-3 are back up:

http://www.knaapo.ru/rus/gallery/events/combat/t-50/t-50-3.wbp

Dude who probably played a part in T-50-4’s structural modifications gets an award:

Инженер-конструктор первой категории ОКБ Сухого Валентин Мартынов стал лауреатом Национальной премии “Золотая идея” в номинации “Молодые таланты” за достижения в области военно-технического сотрудничества, разработки и производства образцов вооружения и военной техники. Он награжден почетным дипломом за работу «Топологическая оптимизация конструктивно-силовых схем элементов планера изделия перспективный многоцелевой истребитель (ПМИ)».

Решение этой задачи является одной из приоритетных в авиастроении и сводится к нахождению оптимального соотношения веса/прочности (жесткости) при соответствующих нагрузках, действующих на конструкцию самолёта.

OKB Sukhoi’s Category 1 engineer Valentin Martynov was awarded the ‘Golden Idea’ national prize in the category “young talents” for achievements in the sphere of military-technical cooperation, the development and manufacture of examples of armament and military equipment. He was awarded an honorary diploma for the “Topological optimization for design elements for use in the future multirole fighter (PMI)” [aka PAK-FA].

The solution of this problem is one of the priorities in the aircraft industry and comes down to finding the optimal ratio of weight/strength (hardness) accounting for the loads acting on the structure of the aircraft.

http://sukhoi.org/news/company/?id=5023

yes, there seems to be something added to the yellow upper panel(is also wider than on T-50-1) in front of the engines, whether it is a reinforcing structure I do not know, but it certainly looks that way.

Yeah, from this shot you can clearly see that ‘ridge’ or clear height difference in the panelling (whether for aerodynamic function or other). Also despite indications of riveting from your screen grab, it is difficult to ascertain whether or not it’s one piece.

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Confucius say “Chinabot brain like Swiss cheese, full of holes!”…

Lol:D

Never mind those braindead posts.
Just report it.
Good riddance to bad photons.

Bender says “are you kiddin’ me?! People pay good money for this sort of material- and we get it for free!!”

Can anyone see the menu & price list on that burger stand?

Just as a comparison an AMD computer with x86 based CPU will deliver 16 TFLOPS (that is 8-16 times the CPU power of the F35) the PSU needed is less than 1000 Watts. Yes, its a standard ATX motherboard.

So your 200KW are not needed, 3-4 KW is enough and that is easily cooled. What was impossible in 1999 or what was ground breaking performance in 2005 is what you can do with an iPhone today. iPhone 4S gives 51 GFLOPS in pure processing power (7,2 @ 200MHz and no relative drop off @ 300Mhz and the processor runs at 800 MHz). So in theory the F22 could run one iPhone 4S and more than double the capacity it currently has.

Cheers.

Not quite, you cannot compare regular commercial CPUs like the ARM chipset on the iPhone 4S with older architecture, redundancy & cooling utilised in the 2 Hughes’ Common Integrated Processors (CIP) aboard the F-22.

Having said that, the progress of current parallel architecture’s computing grunt vs. power consumption is truly astounding. Using your example of the F-35’s >1 TFLOPS, a similar commercial system available next year:

The new Xeon Phi 3100 coprocessor family is specifically targeted at workloads that are “compute-bound”, such as life-science applications like protein folding and financial simulations like stock market forecasting. The Xeon Phi 3100 offers 1-teraFLOPS (1000 gigaFLOPS) and support for 6-Gbytes of memory with 240-Gbytes per second bandwidth–all at less than 300 Watts power consumption.

The Xeon Phi 5110P is shipping today to select customers, with general availability slated for Jan. 28, 2013 at $2,649. The Xeon Phi 3100 coprocessor will be available during the first half of 2013 at less than $2,000.

Intel’s Xeon Phi now comes is two flavors–the 3100 (top) which offers screaming speed at 300 Watts, and the the 5110P (top) which at 225 Watts does not require a fan.

Source: Intel

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