And it would be impossible to push a few JDAM/JSOW out of an airliner flying in to a Chinese city.
I’m talking conventionally, not a terrorist like assymetric act.
And what rocket factory are you talking about? And even they do, what makes you think China would put them near the coast? have you ever figured out how big the country is?
Or then there is the possible assistance that might be obtained from Taiwan for instance in return for recognising the ROC over the PRC.
You could try that, basing Hornets in the ROC, even though the ROC lacks the infrastructure to support them, not to mention the vulnerability of ROCAF bases being bombed and S300 batteries already tracking and locking you the moment you lift off the runaway. Even then I’m not an ethusiastic supporter of the Hornet in strike missions; I tend to think of it like the Stuka, works best when you have total air superiority already.
Fine I cede. No nation with a reasonably competent security and defence apparatus eg Australia could come up with a way of destroying a single factory in China assuming they were prepared to accept the consequence of such an act.
Daniel
With only short legged Hornets and SH, are you kidding? You won’t even reach the shoreline.
the russian one is exploding nuke warhead to clean a whole area. this chinese one is using KKV to directly hit target, which is much more advanced and precise. before this, only america has used KKV to directly hit a sat at 300 mil altitude. it was carried by ASM-135 that launched from a F-15.
the KKV’s weight is very insignificant, so what launcher is used to carry it is not important. if need, china also could use air launcher, it’s very easy. whatever what launcher to be used, the real difficult thing here is how to make KKV directly hit on target. the involved techs could be used to develop ABM system.
Actually the related picture is about launching microsats, not KKVs, though the potential is there.
Here are the microsats



My view is that the SH could use its superior avionics to watch the J-10 run rings around it.
Last time the DoD mentioned the J-10, it was compared to the EF-2000 and Rafale instead of the F-16 Block 30. The Hornet never entered the equation, which may tell you a little about where the Hornet rates (i.e. below all three of them).
The first time, it was compared to the FA-18 Hornet. Then the Super Hornet. Then F-16 Block 30/40. Now the Typhoon and Rafale. I would think more of a plane with its performance somewhere between the Gripen and the Rafale, with avionics comparable to the Block 30 or early ’90s Mirage 2000-5.
Anyway, in terms of avionics, mighjt rate the PLAAF aircraft in this order
J-11B –Holohud, larger radar,
J-10/J-10S (2006 production, satellite uplink revised cockpit, new radar)
J-10 (2003-2004 production)
Su-30MKK/MK2
Su-27SK/vanilla J-11 (everything dated except for brute performance)
Yes it’s very easy that’s why everybody is doing it. Oh, wait. . .:rolleyes:
(Making pretty pictures is one thing. Making the real thing is quite another.)
The PLA usually has a bad habit of turning pics into something very real. One after another…
It was interesting to see that pic, considering they are in the midst of major H-6 upgrade program afterall.
Star49, you don’t know what a paper is do you? That’s not a development being done, that’s development ALREADY DONE at that time, and submitted for review to peers. Read the titles very carefully and they are creating new applicable technologies.
The problem with you is that you cannot connect that applied technologies is much more closer to applicable military technology than basic general research. I have not seen any paper or product to suggest the creation of an X-Ku band MMIC amplifier or an ultra wide band phase shifter. I see general listings of products, not nothing very specific, in frequency, power output
Your list like duh
PRODUCTION
MW- and pulsing semiconductor components:
-Gunn effect diodes
-Microwave mixer and detector GaAs Shottky diodes
-Nonlinear capacitance diodes and turning diodes
-Multiplier diodes
-Pulse diodes
-Rectifier diodes
-Microwave GaAs Schottky FETs
-Monolithic and hybrid GaAs millimeterwave IC
That’s pretty general.
Read this closely, and they mention frequencies and power output, things that amount to very specific products.
GaAs MMIC PROTOTYPES AND PRODUCTSA partial list of GaAs MMICs that NEDI has developed is given below·Power application: power amplifierdriver amplifier·Receiver use: low noise amplifier mixeroscillator/vcobuffer amplifier·Controlled circuits: switch (SPDT, DPDT) phase shifter (analog, digital)attenuator (analog, digital) limiter·Others: active filter active circulator·Frequency range: L to Ku bandSome typical GaAs MMIC prototypes and products with main characteristics are depicted asfollows.·S-band MMIC frequency-variable front-end receiverRF frequency: 2.0-2.5GHzIF frequency: 30-200MHzNF< 1.5dBGP50 ±0.5dBLO power <5dBm VSWR <1.5·C-band MMIC internally-matched power amplifierFrequency: 5.2-6.2GHz GP>11dBPout3w·X-Ku band MMIC power amplifierFrequency 9-13GHz GP13dBPout2w·2-6GHz MMIC power amplifierGP17dB Flatness ±1dB P-129-30dBmFirst Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China28·2-20GHz MMIC distributed power amplifierGP7.5 ±1dB Pout23dBm·MMIC family for T/R module use Frequency 9.3010.4GHzMMIC power amplifier: Po1-1.5w, GP15-20dBMMIC5 bit phase shifter: IL 9.5dB, VSWR 1.5Phase error (RMS) 3oMMIC SPDT switch: IL 1.5dB ISO 25dB·MMIC DPDT switch Frequency 870-970MHz IL 0.8dBISO 20dBVSWR < 1.2P-0.133dBm Control voltage 0,-3V
I have yet to see any mention of a 6″ GaAs wafer fab in Russia.
here are some published papers.
From Google. You need subscription to access.
[PDF] A Compatible Multi-Polarity Control Signals Multi-Octave 180º MMIC …File Format: PDF/Adobe Acrobat
Nanjing University of Science and Technology, Nanjing, China, 210094. [email]daiys@mail.njust.edu.cn[/email] … The author would like to thank the GaAs MMIC production …
ieeexplore.ieee.org/iel5/10688/33745/01606493.pdf?arnumber=1606493 – Similar pages
A Novel Low-Loss Low-Crosstalk Interconnect for Broad-Band Mixed-Signal Silicon MMIC’s – group of 5 »
J Kim, Y Qian, G Feng, P Ma, J Judy, MF Chang, T … – IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1999 – ieeexplore.ieee.org
… VOL. 47, NO. 9, SEPTEMBER 1999 A Novel Low-Loss Low-Crosstalk Interconnect
for Broad-Band Mixed-Signal Silicon MMIC’s Juno Kim …
Cited by 5 – Related Articles – Web Search – BL Direct
A Novel Low-Loss Low-Crosstalk Interconnect for Broad-Band Mixed-Signal – group of 2 »
J Kim, Y Qian, G Feng, P Ma… – citeseer.ist.psu.edu
A Novel Low-Loss Low-Crosstalk Interconnect for Broad-Band Mixed-Signal Silicon
MMIC’s (1999) (Make Corrections) Juno Kim, Yongxi Qian, Guojin Feng, Pingxi Ma …
Cached – Web Search
Millimeter-Wave Silicon MMIC Interconnect and Coupler Using Multilayer Polyimide Technology – group of 3 »
J Kim, Y Qian, G Feng, P Ma, MF Chang, T Itoh – IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2000 – ieeexplore.ieee.org
… VOL. 48, NO. 9, SEPTEMBER 2000 Millimeter-Wave Silicon MMIC Interconnect
and Coupler Using Multilayer Polyimide Technology Juno …
Cited by 4 – Related Articles – Web Search – BL Direct
Untitled DocumentNational NaturalScience Foundation of China. 1996-1998. 14. Prof.Y.Y.Wang. Millimeter wave integrated multiplexer and MMIC technology foundation. 6804003004 …
radio.seu.edu.cn/sklmmw/english/kyxm.htm – 48k – Cached – Similar pages
[PDF] A CMOS Passive Mixer With Low Flicker Noise for Low-Power Direct …File Format: PDF/Adobe Acrobat – View as HTML
Technology of China, Hefei, China, in 1994 and … circuits (MMIC) production. Dr. Chang was named an IEEE Fellow in 1996 for his pioneering contribu- …
http://www.ee.ucla.edu/faculty/papers/mfchang_jssc_may05.pdf – Similar pages
PDF] A novel ultra-wideband 90 degrees GaAs MMIC phase shifter with …File Format: PDF/Adobe Acrobat
524 East Zhongshan Road, Nanjing, P. R. China, Zip 210016, … The authors wish to thank the GaAs MMIC production staff at NEDI MMIC Division for their …
ieeexplore.ieee.org/iel5/7378/20029/00926016.pdf – Similar pages
I add the bold. This one has obvious military implications because China now appears to have ultra low sidelob side scanning radar.
Chinese is building assembly line. it does not have any R&D. nor it has Research papers published in world major universities.
You must be an ass for missing this.
http://216.109.125.130/search/cache?…icp=1&.intl=us
25GaAs MMIC Activities in NEDINanbin YangNanjing Electronic Devices Institute524 E. Zhong Shan Road, Nanjing, 210016, ChinaAbstract:This paper reviews the principal activities of NEDI in the field of GaAs MMIC’s withthe emphasis on the fabrication technologies and products characteristics. It also describes some
highlights of NEDI MMIC development and key resources of NEDI MMIC work.Key Words: GaAs MMIC, MESFET, PHEMT, HBT, Fabrication technologiesI.
INTRODUCTION
Nanjing Electronic Devices Institute (NEDI), founded in 1958, is mainly engaged inmicroelectronics, optoelectronics and vaccum electronics. GaAs MMIC is the one of its most important fields on research, development and production with following highlights.
·Starting in 1978·First GaAs MMIC ( X band oscillator MMIC) in China in 1980·First paper on chinese GaAs MMIC reported on IEEE MTT-s International MicrowaveSymposium in 1981·
Own-designed and made Φ2” GaAs high pressure LEC crystal puller in 1983·First chineseΦ2” GaAs processing line in 1990·
First chineseΦ3” GaAs processing line with MMIC CAD center and heterojunction epitaxialmaterials laboratory in 1996·
Own-designed and madeΦ3”/4” GaAs high pressure LEC crystal puller in 1997·Over 150 prototypes and products of GaAs MMICII.
GaAsMMIC RESOURCESNEDI is possessed of many valuable resources for GaAs MMIC regarding the building, theequipment and instrument, the manpower as well as the technology.·Engineers: 65 (including professors and senior engineers)·Clean room: 1500m2(including 60m2class 10 photolithography area)·Materials: ΔHigh pressure LEC crystal pullers for Φ2”, 3”/4” GaAs ingot ΔMBE forΦ3” GaAs wafer ΔMOCVD for Φ2”, 3” 4” GaAs wafer·Design:ΔWorkstations: HP9000/700, SUN 10 ΔMicrowave devices ,circuits design andanalytical softwares: Ansoft, HP-EESOF, Compact Explore, GATES POSES,First Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China26MDS, ADS, IC-CAP, Cadence·Mask: ΔPattern generator ΔRepeater·Chip fabricationΔSteppers, G-line, I-line ΔDUV mask aligner ΔIR backside aligner Δtrack ΔPECVDsΔRIEs ΔSpray etcher ΔIon implantersΔRTA ΔEB evaperators ΔSputtering systems Δ Wafer lappingmachines ΔWafer polishing machines ΔDicing system
ΔWire bonding machines ΔDie bonding machines·DiagnosticsΔScanning electron microscope Δ1500 x optical microscopesΔEllipsometer ΔHall effect measurement systemΔC-V profiler ΔAlpha step film thickness meterΔStress measuring system·TestΔNetwork analyzers ΔSpectrum analyzersΔNoise analyzers ΔPower testersΔOn-wafer autoprobers ΔParametric testerIII.GaAsMMIC FABRICATION TECHNOLOGIESNEDI has successfully established 3 kinds of Φ3” GaAs fabrication technologies with somefeatures1.Ion implantation MESFET process·Forming a n active layer for the channel and a n+ Ωcontact layers for the sourceand drain by ion implantation·Rapid thermal annealing with a special dielectric encapsulation for increasing theactivation and improving the uniformity.·I-line stepper lithography to print 0.5μm gate·Si3N4passivation for power devices to obtain the breakdown voltage of larger than15V·Air bridge and backside via hole·Si3N4and Ta2O5MIM capacitors·Yield ≥90%·Power: 0.5W/mm(10W C band)2.MBE PHEMT, HFET PROCESS·Unique optical lithography method to realize 0.25μm T-shape gate structure·Double recess to obtain higher breakdown voltageFirst Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China27·Power: 1 W/mm (X band) and 300mW (34GHz)3.MOCVD HBT process·H+implantation for limiting the E—B junction area and realizing the device isolation as well asminimizing the device parasitic effect·Breakdown voltage of the power device can reach to 20V·Stepper lithography to print the E and B with the 0.5μm space between them·Air bridge with SiN passivation and backside via hale·SiN MIM capacitor·Power: 3W/mm (X band)4.Process control monitor (PCM) and statistical process control (SPC)
PCM and SPC are employed on the processing line to monitor the process parameters and
improve the yield.5.Processing capacity
250 wafets/weekIV.
GaAs MMIC PROTOTYPES AND PRODUCTSA partial list of GaAs MMICs that NEDI has developed is given below·Power application: power amplifierdriver amplifier·Receiver use: low noise amplifier mixeroscillator/vcobuffer amplifier·Controlled circuits: switch (SPDT, DPDT) phase shifter (analog, digital)attenuator (analog, digital) limiter·Others: active filter active circulator·Frequency range: L to Ku bandSome typical GaAs MMIC prototypes and products with main characteristics are depicted asfollows.·S-band MMIC frequency-variable front-end receiverRF frequency: 2.0-2.5GHzIF frequency: 30-200MHzNF< 1.5dBGP50 ±0.5dBLO power <5dBm VSWR <1.5·C-band MMIC internally-matched power amplifierFrequency: 5.2-6.2GHz GP>11dBPout3w·X-Ku band MMIC power amplifierFrequency 9-13GHz GP13dBPout2w·2-6GHz MMIC power amplifierGP17dB Flatness ±1dB P-129-30dBmFirst Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China28·2-20GHz MMIC distributed power amplifierGP7.5 ±1dB Pout23dBm·MMIC family for T/R module use Frequency 9.3010.4GHzMMIC power amplifier: Po1-1.5w, GP15-20dBMMIC5 bit phase shifter: IL 9.5dB, VSWR 1.5Phase error (RMS) 3oMMIC SPDT switch: IL 1.5dB ISO 25dB·MMIC DPDT switch Frequency 870-970MHz IL 0.8dBISO 20dBVSWR < 1.2P-0.133dBm Control voltage 0,-3V
—-
Oh Gad all you showed is a Mikron UHF solid state module.
what purpose is for MMIC in comercial use? here is R&D part. it comes under sitronics.
Still no sign of GaN/GaAs fab in Russia, development and production.
MMIC is T/R module as used in the commercial sense of the word. MMIC for example, is the heart of every celphone, wireless router, WLAN, wireless NIC, even portable handset. If its solid state and wireless, it has to use a MMIC. Soon you can even expect microwave ovens using MMIC (solid state microwave generating and amplifying devices) replacing magnetron/klystron/traveling wave tubes.
Look at this PDF in 2002
http://www.gaasmantech.org/Digests/2003/2003PDF/2-1.pdf
Here you got China building at least four GaAs/GaN fab lines.
Sistema’s Mikron electronics plant supplies microchips to China Resources, Leshan Radio Company, BBK, Beijing Alite, Chang Jian, Tian Shui and Nantong Fujitsu
Mikron Electronics, whose micron sizes is still 0.18 and above, supplies chips that are still useful but too obsolescent because the Chinese foundries could no longer produce them once these foundries have moved to a smaller micron size.
Swerve, isn’t China Mobile the biggest?
Russia Transfers Work on China’s Ilyushins
By NABI ABDULLAEV, MOSCOW
http://www.defensenews.com/story.php?F=2476636&C=airwar
Russia’s state arms trader, Rosoboronexport, has decided to return to Russia the bigger part of a $1 billion contract for 38 Il-76 and Il-78 planes ordered by China.
Uzbekistan’s Tashkent Chkalov Aircraft Association (TAPOiCh), which initially was awarded the whole contract in 2005, now will build only 15 of the transport planes as a subcontractor to Russia’s Ilyushin in 2008-2010. Ilyushin will make the remaining 23 planes, said a source in the Russian state-owned aviation holding, the United Aircraft Corp. (UAC).
First deliveries under the contract between Rosoboronexport and China’s Defense Ministry were to begin in 2007. China was to get 34 military transport jet aircraft (NATO codename: Candid) and four Il-78 aerial refueling tankers (NATO codename: Midas) for $1.045 billion.
Contract Was Stalled
But in 2006, TAPOiCh refused to sign a production contract with Rosoboronexport at that price, the UAC executive said.
“TAPOiCh had no big orders for about a decade; many engineers and qualified workers left the enterprise, and I strongly doubt that the plant would be able physically to carry out the whole contract,” the executive said.
The contract got stalled, and Beijing suspended negotiations on several other military procurement contracts with Moscow.
Moving the bulk of the contract to Ilyushin is seen as an attempt to clear the military contracts bottleneck with China, military experts here said.
Viktor Livanov, Ilyushin general director, confirmed the pending contract change with Rosoboronexport, but declined further comment.
Russia’s 23 planes will be built at Ilyushin’s Ulyanovsk-based Aviastar-SP plant. The first plane is expected to be rolled out in 2010, and the Chinese contract is slated to be completed in 2013, the Russian daily Kommersant reported Dec. 27, citing sources in the aviation industry.
The UAC official told Defense News that to complete the contract, Ilyushin and Rosoboronexport will have to find an additional $400 million. He added that there will probably be an internal investigation into how Il-76s and Il-78s were offered to Beijing at a price comparable to that of smaller cargo planes.
To compensate partly for the expenses, Ilyushin refused royalties it was to be paid by TAPOiCh, while Uzbek President Islam Karimov relieved TAPOiCh from having to pay taxes and customs duties for imported parts until the end of 2009, the UAC official said.
In another apparent attempt to boost TAPOiCh’s involvement in the contract, the head of the Russian Federal Agency on Industry, Boris Alyoshin, and UAC President Alexei Fyodorov traveled to Tashkent in November, where they signed a declaration saying that UAC is interested in further cooperation with TAPOiCh and in its eventual entry into the Russian aviation holding.
If Ilyushin carries out the Chinese contract with zero or even negative profit margin, the extra costs still promise Russia eventual returns, said Konstantin Makiyenko, an expert with the Center for Analysis of Strategies and Technologies, a think tank here.
“First, this contract will lead Russia out of the ongoing crisis in the military procurements by China,” he said. “Second, it will allow Ilyushin Co. to set up at home the production lines for the planes that will remain in high demand for the next 10 to 15 years.”
In past years, Venezuela, India and Algeria have expressed interest in buying Il-76s. •
E-mail: [email]nabdullaev@defensenews.com[/email]
just look at the business structure. It includes everything from OIL to Radar and Space. and it does not show subsidaries of subsidaries.
http://www.sistema.com/section.html?s=110
Sorry but that’s not proof of MMIC design, development and mass production.
That’s not proof at all you make MMICs, which are made by a FAB. Cel companies alone don’t make MMICs; in fact, many don’t even make celphones, routers or even repeaters.
China produced its first GaAs MMIC back in 1980.
25GaAs MMIC Activities in NEDINanbin YangNanjing Electronic Devices Institute524 E. Zhong Shan Road, Nanjing, 210016, ChinaAbstract:This paper reviews the principal activities of NEDI in the field of GaAs MMIC’s withthe emphasis on the fabrication technologies and products characteristics. It also describes some
highlights of NEDI MMIC development and key resources of NEDI MMIC work.Key Words: GaAs MMIC, MESFET, PHEMT, HBT, Fabrication technologiesI.
INTRODUCTION
Nanjing Electronic Devices Institute (NEDI), founded in 1958, is mainly engaged inmicroelectronics, optoelectronics and vaccum electronics. GaAs MMIC is the one of its most important fields on research, development and production with following highlights.
·Starting in 1978·First GaAs MMIC ( X band oscillator MMIC) in China in 1980·First paper on chinese GaAs MMIC reported on IEEE MTT-s International MicrowaveSymposium in 1981·
Own-designed and made Φ2” GaAs high pressure LEC crystal puller in 1983·First chineseΦ2” GaAs processing line in 1990·
First chineseΦ3” GaAs processing line with MMIC CAD center and heterojunction epitaxialmaterials laboratory in 1996·
Own-designed and madeΦ3”/4” GaAs high pressure LEC crystal puller in 1997·Over 150 prototypes and products of GaAs MMICII.
GaAsMMIC RESOURCESNEDI is possessed of many valuable resources for GaAs MMIC regarding the building, theequipment and instrument, the manpower as well as the technology.·Engineers: 65 (including professors and senior engineers)·Clean room: 1500m2(including 60m2class 10 photolithography area)·Materials: ΔHigh pressure LEC crystal pullers for Φ2”, 3”/4” GaAs ingot ΔMBE forΦ3” GaAs wafer ΔMOCVD for Φ2”, 3” 4” GaAs wafer·Design:ΔWorkstations: HP9000/700, SUN 10 ΔMicrowave devices ,circuits design andanalytical softwares: Ansoft, HP-EESOF, Compact Explore, GATES POSES,First Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China26MDS, ADS, IC-CAP, Cadence·Mask: ΔPattern generator ΔRepeater·Chip fabricationΔSteppers, G-line, I-line ΔDUV mask aligner ΔIR backside aligner Δtrack ΔPECVDsΔRIEs ΔSpray etcher ΔIon implantersΔRTA ΔEB evaperators ΔSputtering systems Δ Wafer lappingmachines ΔWafer polishing machines ΔDicing system
ΔWire bonding machines ΔDie bonding machines·DiagnosticsΔScanning electron microscope Δ1500 x optical microscopesΔEllipsometer ΔHall effect measurement systemΔC-V profiler ΔAlpha step film thickness meterΔStress measuring system·TestΔNetwork analyzers ΔSpectrum analyzersΔNoise analyzers ΔPower testersΔOn-wafer autoprobers ΔParametric testerIII.GaAsMMIC FABRICATION TECHNOLOGIESNEDI has successfully established 3 kinds of Φ3” GaAs fabrication technologies with somefeatures1.Ion implantation MESFET process·Forming a n active layer for the channel and a n+ Ωcontact layers for the sourceand drain by ion implantation·Rapid thermal annealing with a special dielectric encapsulation for increasing theactivation and improving the uniformity.·I-line stepper lithography to print 0.5μm gate·Si3N4passivation for power devices to obtain the breakdown voltage of larger than15V·Air bridge and backside via hole·Si3N4and Ta2O5MIM capacitors·Yield ≥90%·Power: 0.5W/mm(10W C band)2.MBE PHEMT, HFET PROCESS·Unique optical lithography method to realize 0.25μm T-shape gate structure·Double recess to obtain higher breakdown voltageFirst Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China27·Power: 1 W/mm (X band) and 300mW (34GHz)3.MOCVD HBT process·H+implantation for limiting the E—B junction area and realizing the device isolation as well asminimizing the device parasitic effect·Breakdown voltage of the power device can reach to 20V·Stepper lithography to print the E and B with the 0.5μm space between them·Air bridge with SiN passivation and backside via hale·SiN MIM capacitor·Power: 3W/mm (X band)4.Process control monitor (PCM) and statistical process control (SPC)
PCM and SPC are employed on the processing line to monitor the process parameters and
improve the yield.5.Processing capacity
250 wafets/weekIV.GaAs MMIC PROTOTYPES AND PRODUCTSA partial list of GaAs MMICs that NEDI has developed is given below·Power application: power amplifierdriver amplifier·Receiver use: low noise amplifier mixeroscillator/vcobuffer amplifier·Controlled circuits: switch (SPDT, DPDT) phase shifter (analog, digital)attenuator (analog, digital) limiter·Others: active filter active circulator·Frequency range: L to Ku bandSome typical GaAs MMIC prototypes and products with main characteristics are depicted asfollows.·S-band MMIC frequency-variable front-end receiverRF frequency: 2.0-2.5GHzIF frequency: 30-200MHzNF< 1.5dBGP50 ±0.5dBLO power <5dBm VSWR <1.5·C-band MMIC internally-matched power amplifierFrequency: 5.2-6.2GHz GP>11dBPout3w·X-Ku band MMIC power amplifierFrequency 9-13GHz GP13dBPout2w·2-6GHz MMIC power amplifierGP17dB Flatness ±1dB P-129-30dBmFirst Joint Symposium on Opto- and Microelectronic Devices and Circuits, April 10-15, 2000, Nanjing, China28·2-20GHz MMIC distributed power amplifierGP7.5 ±1dB Pout23dBm·MMIC family for T/R module use Frequency 9.3010.4GHzMMIC power amplifier: Po1-1.5w, GP15-20dBMMIC5 bit phase shifter: IL 9.5dB, VSWR 1.5Phase error (RMS) 3oMMIC SPDT switch: IL 1.5dB ISO 25dB·MMIC DPDT switch Frequency 870-970MHz IL 0.8dBISO 20dBVSWR < 1.2P-0.133dBm Control voltage 0,-3V
—-
The paper was submitted on year 2000. I made bold on the text one of the MMIC with military applications.
I have read it and it is another firm inside Russia. Russians built market for themselves by buying Cell networks for 10 to 15 countries and than become equipment suppliers to there own networks. just look at ther Infinitewireless wimax tech.
u have no idea about this new business model it is there own creation.
Thats nonsense. There are many celphone companies in the world, but none produces MMICs. Buying a celphone company does not buy the fabs that produce MMICs.
form where this information comes from that Russia does not have TTLs and MMIC capabilitiy? how that Phazotron AESA built? and about money one of there firms just bought Turkish Cellular for $4B in cash.
Maybe you didn’t read what Phazotron said. They could buld the entire radar except for the TTL module which they had to source somewhere else. Buying a celphone company does mean you also get the facilities to manufacture celphone circuits like MMICs.